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ePack's Packaging Solutions |
SOLUTIONSePack's solutions are developed specifically for your application. Let ePack help you bring your products to market faster with superior packaging technology.
|  |  | ePack can provide an electrical connection to your
MEMS device in three ways: - Vertical feed-through interconnects
- Lateral feed-through interconnects
- Wireless telemetry, sensing and power | ePack is the world expert in wafer level vacuum/
hermetic packaging of MEMS devices: - Au-Si eutectic & solder bonding
- Anodic & glass frit bonding
- Polymers & biomedical
- Multi-stack process integration | ePack's isolation MEMS technology is designed to
protect MEMS devices from temperature fluctuations, vibration and mechanical shock. This technology has been developed specifically for high-performance MEMS applications. | KEY FEATURES | KEY FEATURES | KEY FEATURES
| - Integration into almost any process
- Cap and device wafer feed-throughs
- Wide range of materials; Poly-Si, metals, solder
and bulk SI
- Wireless interconnection
| - Small size: 1000s of devices/wafer
- Low unit prices
- Vacuum pressure ranges of 1mTorr to 760 Torr
- Proven reliability
- Lead free
| - Temperature stability of ±0.5C at <50mW for
ambient temperatures from -40C to 80C
- Filters out vibration > 1kHz
- High performance shock protection | MEMS APPLICATIONS
| MEMS APPLICATIONS | MEMS APPLICATIONS | - All MEMS applications
| - Gyroscopes and accelerometers
- Resonators and switches
- Bolometers and thermopiles
- Pressure sensors and microphones | - Navigation grade gyroscopes
- Oven controlled oscillators |
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