Packaging that provides protection from external disturbances such as temperature, vibration and shock in a vacuum environment.

The high performance hybrid packaging which ePack provides is the culmination of a number of different wafer bonding, feed-through, glass etching and other state of the art MEMS processing technologies.  These technologies are patented and feed into many of our standard wafer-level packaging solutions.

ePack's generic processes allow for the packaging of almost any MEMS device with minimal design modifications. This provides you with a faster time to market and lower development costs.

ePack's Hyrid Packaging solutions are perfect for navigation grade gyroscopes and oven-controlled oscillators.